WitrynaThe beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu 6 Sn 5 phase at the joint interface. The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were ... Witryna20 gru 2024 · A new multilayer metallization, electroless-nickel electroless-palladium immersion gold (ENEPIG) with a thin 0.1-μm-thick Ni(P) layer (thin-ENEPIG), was plated onto a Cu printed circuit board substrate for fine-pitch package applications. We evaluated the interfacial reactions and mechanical strengths of Sn–3.0Ag–0.5Cu …

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WitrynaImmersion Silver and Semi-Autocatalytic Gold Plating Umicores´ silver and gold plating process (ISIG) provides customers a high performance nick- ... 1.2) g/l Ag pH value … Witryna25 lip 2024 · Confirmation of deposition reaction: In order to determine the oxidation reaction of “DIG R”, which is the reducing agent of Direct Immersion Gold, the rest potential was measured using a gold electrode and a copper electrode. The standard electrode was Ag/AgCl, and the working electrode was copper and gold plate. … on-site inspection business service

Evaluation of the crystalline structure of Ag+-doped ZnO thin …

Witryna1 wrz 2000 · The immersion Ag coating has a finer grain structure than the immersion Sn coating. The Sn has a well polygonized grain structure which had been reported helpful to resist dendritic growth and ... Witryna1 lip 2010 · The solder joint microstructures of immersion Ag with Sn-xZn (x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn … Witryna30 cze 2008 · The thickness of the Ag plating layer is approximately 4 μm. Rosin Interfacial reactions. As the Sn–3.5Ag–0.7Cu/immersion Ag-plated Cu interface was reflowed at 250 °C for 60 s, the topmost Ag layer was dissolved completely into the molten Sn–Ag–Cu solder, leaving the Cu layer exposed to the molten solder. The … iod brighton